| 摘要 |
A flame retardant thermosetting resin composition having improved properties as an electrical insulating material and being particularly suited for use in printed circuit boards composed essentially of acryloyloxy- or methacryloyloxy-terminated butadiene homopolymer or butadiene copolymer with, for example, acrylonitrile or styrene, ethylenically unsaturated monomer capable of copolymerizing with the terminating acryloyloxy- or methacryloyloxy- groups of the butadiene homopolymer or copolymer, which monomer has a substantial amount of haloaryl, and acid anhydride having at least one ethylenically unsaturated group. In preferred compositions of the invention, there are from 1.5 to 3.0 terminating acryloyloxy- or methacryloyloxy- groups per molecule of the butadiene homopolymer of copolymer, the amounts of ethylenically unsaturated monomer and of acid anhydride are from 150 to 500 weight percent and from 5 to 20 weight percent, respectively, based on the weight of terminated butadiene homopolymer or copolymer, and the amount by weight of halogen is 25 to 70 percent of the weight of the composition. A particularly desirable composition is obtained when the acryloyloxy- or methacryloyloxy-terminated polymer or copolymer is at least 70 weight percent 1,2-polybutadiene; chlorine and bromine are the halogens, bromine being preferred.
|
