发明名称 Epoxy resin compositions
摘要 In an epoxy resin composition comprising an alicyclic epoxy resin, a curing agent having phenolic hydroxyl group in its molecule and an imidazole curing accelerator, excellent thermal resistance and excellent mechanical properties can be given to the cured epoxy resin composition by blending 100 parts by weight of 2-(3,4-epoxy)cyclohexyl-5,5-spiro(3,4-epoxy)cyclohexane-m-dioxane as the alicyclic epoxy resin, 25 to 50 parts by weight of a phenol-formaldehyde condensate as the curing agent having phenolic hydroxyl group in its molecule and 0.1 to 15 parts by weight of at least one imidazole compound selected from the group consisting of 2-phenylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 2-phenyl-4-methylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-methyl-4-ethylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-azine-2-methylimidazole, 1-azine-2-undecylimidazole and 1-azine-2-ethyl-4-methylimidazole as the imidazole curing accelerator.
申请公布号 US4026872(A) 申请公布日期 1977.05.31
申请号 US19760685532 申请日期 1976.05.11
申请人 HITACHI, LTD. 发明人 SAIDA, KENICHI;SAKAI, MASAHIKO;NARAHARA, TOSHIKAZU
分类号 C08G59/00;C08G59/20;C08G59/24;C08G59/40;C08G59/68;C08J5/24;C08L63/00;(IPC1-7):C08L61/10;C08L63/02 主分类号 C08G59/00
代理机构 代理人
主权项
地址