发明名称 Chipboard embossing matrix - made from a thin metallic foil coated with thermosetting resin pressed at setting temp. 130 to 170 degrees centigrade
摘要 <p>Panel embossing matrix is formed by a metallic substrate provided with a layer of synthetic resin whose face is provided with an embossed pattern. Pref. the substrate which is thin and has a thickness of several tenths of a mm. is made from an alloyed steel or Al and takes the shape of a foil which is attachable to an embossing drum or a web forming part of an endless conveyor belt. The matrix is useful for embossing chipboard or hardboard panels used in furniture industry. It has good heat transfer properties and is economically manufacturable.</p>
申请公布号 DE2552547(A1) 申请公布日期 1977.05.26
申请号 DE19752552547 申请日期 1975.11.22
申请人 KARL KUEBEL WOHNMOEBEL GMBH 发明人 NORMANN,HANS
分类号 B29C33/68;B29C43/02;B29C43/18;B29C59/00;B29C70/72;B30B15/02;B44B5/02;(IPC1-7):44B5/02;30B15/02;29D7/22 主分类号 B29C33/68
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