| 发明名称 |
Ohmic contacts to thin film circuits |
| 摘要 |
A process for establishing gold contact studs on thin film circuits consists in localized sublayer deposition of a platinum-gold alloy followed by subsequent electrolytic gold thickening of the studs. The studs so produced are particularly fit for thermocompression interconnection.
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| 申请公布号 |
US4025404(A) |
申请公布日期 |
1977.05.24 |
| 申请号 |
US19750628846 |
申请日期 |
1975.11.04 |
| 申请人 |
SOCIETE LIGNES TELEGRAPHIQUES ET TELEPHONIQUES |
发明人 |
JOLY, JEAN;RANGER, JEAN BERNARD |
| 分类号 |
H01L21/48;(IPC1-7):C25D5/00;C23C15/00;H01H37/36 |
主分类号 |
H01L21/48 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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