发明名称 Process for soldering an electrocoated substrate
摘要 A process for soldering a metal substrate coated with an electrodeposited non-peelable coating comprising 35-65 wt parts of methacryl ester, 10-40 wt parts of acrylonitrile, 2-15 wt parts of methacrylic acid, 3-10 wt parts of acrylamide and/or vinyl acetate, in 100 parts of resin.
申请公布号 US4025037(A) 申请公布日期 1977.05.24
申请号 US19750581621 申请日期 1975.05.28
申请人 MITSUBISHI DENKI KABUSHIKI KAISHA 发明人 SHIBAYAMA, KYOICHI;ONO, HIROSHI;JIDAI, EIKI;SAEKI, HIDEO
分类号 B23K35/22;C09D5/44;H01B3/44;H01B7/18;H01B13/06;(IPC1-7):B23K1/02;C25D13/06 主分类号 B23K35/22
代理机构 代理人
主权项
地址