发明名称 |
Process for soldering an electrocoated substrate |
摘要 |
A process for soldering a metal substrate coated with an electrodeposited non-peelable coating comprising 35-65 wt parts of methacryl ester, 10-40 wt parts of acrylonitrile, 2-15 wt parts of methacrylic acid, 3-10 wt parts of acrylamide and/or vinyl acetate, in 100 parts of resin.
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申请公布号 |
US4025037(A) |
申请公布日期 |
1977.05.24 |
申请号 |
US19750581621 |
申请日期 |
1975.05.28 |
申请人 |
MITSUBISHI DENKI KABUSHIKI KAISHA |
发明人 |
SHIBAYAMA, KYOICHI;ONO, HIROSHI;JIDAI, EIKI;SAEKI, HIDEO |
分类号 |
B23K35/22;C09D5/44;H01B3/44;H01B7/18;H01B13/06;(IPC1-7):B23K1/02;C25D13/06 |
主分类号 |
B23K35/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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