| 摘要 |
1293710 Connections for semi-conductor devices PHILIPS ELECTRONIC & ASSOCIATED INDUSTRIES Ltd 9 Aug 1971 [12 Aug 1970] 37351/71 Heading H1K Metal leads 4 arranged in a frame 5 are attached to the completely metallized surface of an insulating substrate 1 and the substrate surface is subjected to etching or blasting with particles of alumina, silicon carbide or sand, &c., to remove the metallization except where it is covered by the leads 4. In this way mutually isolated connections, to which the soldercovered electrodes of a semi-conductor body containing an integrated circuit may be attached, are provided on the substrate 1. The substrate 1 may be of aluminium oxide or beryllium oxide and is preferably covered first with Ti and then with Ni or Cu. Hard or soft soldering, ultra-sonic welding or thermo-compression bonding may be used to secure the leads 4 to the metallization. The assembly including the semi-conductor body is encapsulated in resin, and may optionally be arranged in a second conductor array and encapsulated again. |
