发明名称 |
Method for making beam leads for ceramic substrates |
摘要 |
A method for making beam leads for use in the interconnecting of electronic devices and packages. A first metal is deposited onto a substrate which has poor adhesion with the substrate. A portion of the deposited metal is then etched away leaving on said substrate deposited metal at locations where a second metal is not to adhere to the substrate. Then depositing onto said substrate and over said first deposited metal a plurality of beam leads of a second metal. Then lifting said portions of said first metal from said substrate and then etching away said first metal to provide beam leads partially attached to said substrate.
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申请公布号 |
US4022641(A) |
申请公布日期 |
1977.05.10 |
申请号 |
US19760673339 |
申请日期 |
1976.04.02 |
申请人 |
THE UNITED STATES OF AMERICA AS REPRESENTED BY THE SECRETARY OF THE NAVY |
发明人 |
LINDBERG, FRANK A. |
分类号 |
H01L21/48;H01L21/60;H01L21/607;H05K1/03;H05K3/40;(IPC1-7):C23F1/02 |
主分类号 |
H01L21/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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