| 摘要 |
<p>The embodiment of the invention disclosed herein is directed to a method and apparatus for forming metallized film capacitors. A pair of conductive lead wires are positioned in spaced-apart parallel relation to one another and a film having metallized conductive surfaces formed on both sides thereof is positioned between the conductive lead wires. Metallic foil strips are positioned between the respective metallized surfaces and their associated conductive lead wire to provide electrical contact between the metallized surfaces and their respective conductive lead wire. The electrical lead wires are rotated about an axis located between the lead wires to wrap the metallized film and metallic foils thereabout. To insure insulation between the opposite conductive surfaces of the metallized film, a layer of dielectric film is inserted on one side thereof. A removable mandrel is inserted adjacent the conductive lead wires to hold the free end of the dielectric film in position during the initial winding operation. One end of each side of the double-sided metallized film is provided with an unmetallized margin and the ends of the capacitor are sprayed with a conductive film when the capacitor is formed to reduce the resistance of the unit.</p> |
