| 摘要 |
A polishing composition suitable for polishing semi-conductive materials, e.g. silicon and germanium, comprises an aqueous slurry containing as a polishing agent a finely divided calcium-titanium-zirconium-oxygen product having the empirical formula CaTiZr3O9. Additional materials that may be present include sodium hypochlorite, sodium metasilicate, potassium hydroxide, and glycerine.
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