发明名称 |
Vapor bonding method |
摘要 |
Components, printed circuit board assemblies and the like to be interconnected by soldering are appropriately fluxed and placed in an atmosphere of a saturated vapor derived from a heat transfer liquid medium having a boiling point above the melting point of the solder. The heat transfer medium is chosen to have a solubility parameter compatible with the solubility parameter of the flux to eliminate the need for subsequent flux cleaning.
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申请公布号 |
US4022371(A) |
申请公布日期 |
1977.05.10 |
申请号 |
US19760695482 |
申请日期 |
1976.06.14 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
SKARVINKO, EUGENE ROMAN;VON VOSS, WILLIAM DITLEF |
分类号 |
H05K3/34;B23K1/00;B23K1/015;B23K35/38;(IPC1-7):B23K1/04 |
主分类号 |
H05K3/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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