发明名称 Liquid cooled mount for power semiconductors - has stack of ceramic encased semiconductors immersed in liquid in finned metal casing
摘要 <p>The liquid cooled mount, for power semiconductors in locomotives, has the ceramic-encased semiconductors (e.g.5) (diodes and/or thyristors) mounted in a stack in the usual way between two end plates (10,11) and fixed via an insulator (24) to a base plate (23) through which the electrical connections pass. The base plate forms the end plate of a cylindrical aluminium housing (1) filled with the cooling liquid, e.g. liquid flourine hydrocarbon (freon). The outer surface of the housing has fins (25). The base plate is bolted and sealed to the open end of the housing.</p>
申请公布号 FR2327642(A1) 申请公布日期 1977.05.06
申请号 FR19750030527 申请日期 1975.10.06
申请人 ALSTHOM STE GLE CONST ELECT MECA 发明人 MICHEL MASSELIN, BERNARD LEGRAND ET GILBERT VIDAL
分类号 H01L23/40;H01L23/427;H01L23/44;H01L25/11;(IPC1-7):01L23/44;61C17/00;60K11/00 主分类号 H01L23/40
代理机构 代理人
主权项
地址