| 摘要 |
The semiconductor device has a support base with an integrated circuit semiconductor chip. electric conductors protrude laterally from the support base. An earthing spring terminalk (10) is formed in one piece with a cover part, insertable onto the base. The assembly contains terminal parts (26, 27) for contacting each conductor (13, 17). The terminal parts are so shaped that, with the spring terminal in position, the conductors are connectable to the respective integrated circuit, while the terminal parts are still earthed by friction with the earthing spring terminal, which is cancelled on proper connection. |
