Connection of leads to a semiconductor substrate - using a single substrate lead frame

摘要

Method of making a lead array for a semiconductor device in which connection pads are formed on a semiconductor substrate at its periphery and a number of flexible metal leads are connected to the pads extending inwards towards the active regions and the part of the conductor covering the pad is joined it. One or more wires may then be connected to each pad. The method provides a lead array on the same substrate as the integrated circuit.