| 摘要 |
A diode package comprising a compressible dielectric member having an aperture extending through its two major opposite surfaces. An electrically conductive lid is attached on one of the major surfaces of the dielectric member and an electrically conductive base is attached on the other surface. A semiconductor diode having two terminals oppositely situated is soldered with one diode terminal to the base within the aperture of the dielectric member. The lid is further soldered to the other diode terminal subsequent to the compressible dielectric member being compressed an amount sufficient for the lid to make an electrical connection to the other diode terminal.
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