| 摘要 |
<p>1471495 Cooling semi-conductor devices GENERAL ELECTRIC CO 31 May 1974 [18 June 1973] 24220/74 Heading H1K A heat-pipe cooling assembly for a semiconductor device 10 comprises thermally and electrically conductive cup-shaped members 11, 12 bonded to the device and at least one non- wicked heat-pipe 16, 17 thermally and electrically in contact with one of the members 11, 12 through a thin metal film 14, 15 which is a liquid during operation of the device at least. The creepage path across the device is lengthened by means 13 around the members 11, 12. As shown, the device may be cooled on both faces either with one wicked heat-pipe 17 and one gravity-feed heat-pipe 16 having a heat absorptive surface layer 18, 19 or with two non-wicked heat-pipes. If the body of the device 10 is of Si then the cup members 11, 12 are of Mo, W, Al or Cu and are brazed, soldered or otherwise bonded to the device 10. The thin metal films 14, 15, which must wet the surfaces, may be pure Ga, or of NaK alloy or a eutectic alloy of Sn, Pb, Sb, Bi and Cd. The creepage path lengthener 13 may be of ceramic or silicone rubber and can fill the space 13a or this may alternatively be filled with N 2 . Current is passed through the device 10 via the cup-shaped members 11, 12 and heat sinks which are clamped together in an insulated manner (Fig. 2, not shown).</p> |
