Semiconductor device with clamped chips - uses prestressed coiled springs on clamping bolts for compression between stack holding pressure elements

摘要

Several semiconductor disc-shaped chips ate clamped between pressure elements in such manner that the chips abut the respective pressure elements with opposite lateral surfaces. Clamping bolts extend at right angles to the element plane. Their one end is connected by a yoke, abutting the adjacent pressure element via springs. Coiled springs (15) are provided for this abutment and afford prestressing for this purpose. Preferably stops or spacing pins (12) are provided between the yoke (11) and the adjacent pressure element (5). The coiled springs may be mounted on the clamping bolts (6), or alternately on the spacing pins.