发明名称 MANUFACTURE OF LAMINATED CERAMIC ELECTRONIC COMPONENT
摘要 <p>PURPOSE:To easily separate a laminated layer support and a chiplike laminated layer molded form and to reduce its manufacturing cost by providing a separate sheet made of shape memory alloy on the support, then manufacturing a laminated layer molded form, cutting it in a chip state, then heat treating it, and separating the form from the support. CONSTITUTION:A separate sheet 1 made of shape memory alloy is placed on a laminated layer support 2, a dielectric green sheet 3 is pressed thereon by a press to manufacture a laminated layer molded form 7. Thereafter, the form 7 is cut in a chip state, the form 7 is heated at each sheet 1, the sheet 1 made of the alloy is formed in a wavy state, and the form 7 is easily separated from the support 2. It is returned to the original shape of the flat sheet by cooling, and the sheet is repeatedly used.</p>
申请公布号 JPH0391219(A) 申请公布日期 1991.04.16
申请号 JP19890227715 申请日期 1989.09.01
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 KATO MASAHIRO;NAKAO KEIICHI;HORIBE YASUTAKA;OKUYAMA HIKOHARU
分类号 H01G4/12;H01C7/10;H01F41/04;H03H3/02 主分类号 H01G4/12
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