发明名称 KETENPAKKET MET EEN BASISPLAAT EN DETAILPLATEN.
摘要 1,106,557. Circuit assemblies. INTERNATIONAL BUSINESS MACHINES CORPORATION. 17 Feb., 1966 [1 June, 1965], No. 6936/66. Addition to 1,023,980. Heading H1R. [Also in Division H2] In an electrical circuit assembly, Fig. 1, a plurality of parallel multilayer printed circuit cards 21, each supporting circuit modules 25 and associated components 27, are mounted by connector devices 29 on a multilayer printed circuit board 23, a plurality of boards 23 being mounted coplanar and interconnected by coaxial cables 31. Each printed circuit card 21, Figs. 4, 5 (not shown), comprises five copper layers mutually insulated by intermediate insulating layers of e.g. epoxy glass. The two outer Cu layers (67) are etched to form signal wiring while the internal Cu layers (57, 101) form ground and voltage planes. Holes (51) are drilled through the cards and plated to receive the leads of modules (Fig. 2, not shown), and components, which are soldered in the holes. At one side, each card has printed on both faces contact tabs (47) which contact the signal wiring, and along the edge voltage and ground contacts (49) are secured, connected as necessary to the ground and voltage planes of the card. As shown in Fig. 1, the cards 21a, 21b, 21c, may be of different widths. Each printed circuit board 23, Figs. 9, 10, 11 (not shown), comprises three discrete multilayer printed circuit laminates (23-1, 23-2, 23-3), held together in spaced parallel relation by pins (85, 87, 89) mounted in selected plated-through holes (79), of which a rectangular co-ordinate array is provided in the board. At each card position, five columns of holes (79) are provided; the central column has alternate holes occupied by headed pins (87) which are connected to voltage or ground planes in the board; the two adjacent columns are provided with longer pins (85) for signal connections; and the two outer columns have shorter headed ground pins (89) which stop short of the front surface of the board. Similar cable positions are located around the periphery of the board. The board may have a plastic stiffener of the kind described in Specification 1,021,989 bonded to its front surface, and the spaces between the separate laminates may be filled with epoxy. Each hole (79) has a metallized area (81) around it on the front surface of the board, and selected metallized areas (81) are interconnected by printed wiring (83, 131). Connector 29, Figs. 12, 13 (not shown).- Inverted U-shaped spring contacts (95) are soldered to the signal contact tabs on the card (21), and the contact-bearing edge of the card is inserted in an elongated rectangular plastics housing (105) having card-retaining clips (109) at each end and transverse separators (107) extending inwardly from the side-walls. The housing (105) containing the card (21) is mounted on the board (23) so that the signal pins (85) make resilient contact with gold contact points (97) on the spring contacts (95), while the voltage and ground contacts (49) on the card make wiping contact with the heads of the headed pins (87) on the board. Cable connections.-A "ground rake (117, Fig. 16, not shown), comprising an elongated bus portion from which a plurality of hollow teeth project is mounted on the ground pins (89) at the rear face of the board (23) to form a column of ground connections alongside each column of signal pins (85). Each coaxial cable (31, Fig. 17, not shown) is terminated with an insulating housing (129) containing a first female contact (123) to which the central signal wire of the cable is crimped and which engages the rear of a signal pin (85), and a second female contact (125) to which the outer conductor of the cable is soldered and which engages an adjacent tooth of the ground rake (117). Fig. 19 (not shown) depicts a voltage distribution bus-bar comprising a plurality of Cu strips (141) laminated together by dielectric material, each strip having an integral tab (143) which is screwed to a removable Cu tab (145) having one end bifurcated to provide a pair of pins which are bent perpendicular and soldered into plated holes (79) in the board (23).
申请公布号 NL153061(B) 申请公布日期 1977.04.15
申请号 NL19660002603 申请日期 1966.02.28
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION, ARMONK, NEW YORK, VER. ST. V. AM. 发明人
分类号 G06F1/00;G06F1/18;H01L23/538;H01R12/50;H05K1/14 主分类号 G06F1/00
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