发明名称 |
PROCESS FOR ATTACHING A LEAD MEMBER TO A SEMICONDUCTOR DEVICE AND PRODUCTS THEREOF |
摘要 |
<p>A thermally and electrically conductive metal lead member is joined to the refractory metal contact member of a semiconductor device using a brazing alloy comprising on a weight basis about 80-89 percent copper, about 5-15 percent silver, and about 4-6 percent phosphorus. The contact member/semiconductor joint may be formed in an inert atmosphere at the same time and at the same temperature as the contact member/lead member joint.</p> |
申请公布号 |
CA1008566(A) |
申请公布日期 |
1977.04.12 |
申请号 |
CA19750217950 |
申请日期 |
1975.01.15 |
申请人 |
GENERAL INSTRUMENT CORPORATION |
发明人 |
GOLDBERG, MONROE B.;VOORHIS, WILLIAM B. |
分类号 |
B23K35/30;H01L21/60;H01L23/051;H01L23/31;H01L23/48;H01L23/488;H01L23/492 |
主分类号 |
B23K35/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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