发明名称 Circuit assembly as for a T-element
摘要 A circuit assembly as for an attenuation circuit is constructed upon a glass or ceramic substrate. T-element attenuators are formed on one face of the substrate by a film-circuit technique. Connections to electrodes of the T-element resistances are made by contact elements having clamping portions which engage an edge of the substrate to overlie the respective electrodes. One side of each contact element is extended from the clamping portion to form a contact arm having a forked end spaced adjacent the face of the substrate. The electrodes and contact elements are spaced apart longitudinally of the substrate and the contact arms alternate longitudinally between front and back faces thereof. Wire bridge connections are then readily made between successive arms on one or the other side of the substrate to turn on or off the individual T-element attenuator. Further, a connecting rod extends from each contact element normally to the edge of the substrate and parallel to the face of the substrate to engage a bore in a carrier plate upon assembly. Such rods connect to cross-pieces to facilitate assembly onto the substrate, one cross-piece for each set of contact elements having connecting arms on one side of the substrate.
申请公布号 US4017821(A) 申请公布日期 1977.04.12
申请号 US19750636428 申请日期 1975.12.01
申请人 SIEMENS AKTIENGESELLSCHAFT 发明人 SCHMIDT, GERHARD
分类号 H01R9/00;H01C1/16;H01C10/50;H01L23/498;H01R12/04;H05K3/22;(IPC1-7):H01C10/06 主分类号 H01R9/00
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