发明名称 ELECTROLESS PLATING
摘要 Metallic surfaces are imparted to non-conductive or dielectric substrates by an electroless coating process comprising coating the surface of the substrate with a hydrous oxide colloid of non-precious metal ions preferably selected from the group consisting of cobalt, nickel and copper ions, reducing the selected metal ions to a reduced or zero valence state with a suitable reducing agent, and exposing the substrate to an electroless plating bath.
申请公布号 AU8543775(A) 申请公布日期 1977.04.07
申请号 AU19750085437 申请日期 1975.10.03
申请人 SURFACE TECHNOLOGY, INC. 发明人 NATHAN %NMI< FELDSTEIN
分类号 C23C18/28;H05K1/03;H05K3/18 主分类号 C23C18/28
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