发明名称 Apparatus for the manufacture of tubular bodies of semiconductor material
摘要 For the manufacture of tubular bodies of semiconductor material, particularly of silicon, by the precipitation of a layer in the form of a hollow cylinder on a rod or tube-shaped,electrically heated carrier in a reaction gas suitable for the deposition of the semiconductor in question, with subsequent separation of the semiconductor layer from the carrier, the carrier is differentially heated in such a manner that the generated hollow-cylinder layer is given an annular, bead-like reinforcement; the separation of the tube obtained into parts is achieved by a cut made within the reinforcement.
申请公布号 US4015922(A) 申请公布日期 1977.04.05
申请号 US19760658892 申请日期 1976.02.18
申请人 SIEMENS AKTIENGESELLSCHAFT 发明人 DIETZE, WOLFGANG;REUSCHEL, RONRAD;KASPER, ANDREAS
分类号 C23C16/01;C23C16/22;C30B23/00;(IPC1-7):B29D23/00 主分类号 C23C16/01
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