发明名称 |
Apparatus for the manufacture of tubular bodies of semiconductor material |
摘要 |
For the manufacture of tubular bodies of semiconductor material, particularly of silicon, by the precipitation of a layer in the form of a hollow cylinder on a rod or tube-shaped,electrically heated carrier in a reaction gas suitable for the deposition of the semiconductor in question, with subsequent separation of the semiconductor layer from the carrier, the carrier is differentially heated in such a manner that the generated hollow-cylinder layer is given an annular, bead-like reinforcement; the separation of the tube obtained into parts is achieved by a cut made within the reinforcement.
|
申请公布号 |
US4015922(A) |
申请公布日期 |
1977.04.05 |
申请号 |
US19760658892 |
申请日期 |
1976.02.18 |
申请人 |
SIEMENS AKTIENGESELLSCHAFT |
发明人 |
DIETZE, WOLFGANG;REUSCHEL, RONRAD;KASPER, ANDREAS |
分类号 |
C23C16/01;C23C16/22;C30B23/00;(IPC1-7):B29D23/00 |
主分类号 |
C23C16/01 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|