| 摘要 |
An automated package binding apparatus and an improved method to apply thereto in the welding of a thermoplastic tape winding round a package. Said apparatus may be common to known devices of the kind in various regards but being novel at least in the equipping of one or two bimetals element therein, said bimetal making possible the adjustment of the temperature of the heaters provided for cutting and melting thermoplastic tape. The invention contemplates the preliminary heating of said heaters to around 500 DEG -700 DEG C and applying of said heaters to the cutting and melting of the tape when the temperature is lowered to a suitable temperature around 400 DEG -500 DEG C through the lapse of time after cutting off the power supply to said heaters. The preliminary heating of said heaters facilitate the diffusion of heat uniformly on the entire surface of said heaters and accordingly uniform melting of said tape.
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