| 摘要 |
PURPOSE:To check damage of loading parts and bending of leads when glass terminals are to be plated by a method wherein the leads are welded to a common connecting conductor in spots, and a current is made to flow to forms plated layers. CONSTITUTION:Plating treatment is performed to the head parts of inside leads 1 on the loading side of a semiconductor chip, etc., for example, of glass terminals for performance of wire bonding connection. To perform plating treatment thereof, the leads 1 of the glass terminals of the plural number are placed in a row in parallel at first, and a rectilinear common connecting conductor 4 consisting of iron, etc. is connected to the outside lead parts having the prescribed distance from metal bases 2. Connection thereof is performed continuously according to the spot welding method, and a condition connecting the glass terminals of the plural number in a line is formed. Then the terminals are immersed in a plating solution placing down the loading side of the semiconductor chip, etc. of the metal bases 2, and a current is flowed to the common connecting conductor 4 to form plated layers to the parts to be connected by bonding of the head parts of the inside leads. After the plated layers are formed, the prescribed parts of the leads 1 between the metal bases 2 of the respective glass terminals and the common connecting conductor 4 are cut out to separate the glass terminals into the respective glass terminals. |
