| 摘要 |
1469085 Semi-conductor devices INTERNATIONAL BUSINESS MACHINES CORP 20 May 1975 [19 Aug 1974] 21625/75 Heading H1K A semi-conducting wafer 10, Fig. 1, is provided with an aperture 12 and a surface metallization pattern providing an array of conductors 14 leading to external connection positions respectively adjacent the periphery of the wafer and adjacent the periphery of the aperture. The conductors 14 may interconnect circuit elements e.g. transistors, integrated in the wafer or alternatively, separately formed integrated circuit chips mounted on the wafer 10. The wafer may have more than one aperture and may be secured to a multilayer substrate 20, Fig. 2, of alternate layers of ceramic material or epoxy glass 24 and conducting material 22, by a gold eutectic bond, soldering or by a thin layer of thermally conductive plastics material 40. The substrate 20 is provided with holes 26 through which electrical connectors 30 provided with pads 28 extend to the desired conductive layer 22. Each external connection position is provided with a pad 18, its connection to the wafer being made by thermal compression bonds, &c. The apertures may be formed by chemical etching, abrasive cutting with a tool or by using a laser. |
