发明名称 Gold-colored alloy solders
摘要 A gold-colored alloy solder for use with dental gold alloys and gold-colored jewelry alloys includes the following ranges of constituents in percentages by weight: }Constituent Proportional Range }Gold 60 - 70% }Platinum 0 - 10% }Palladium 0 - 10% }Copper 10 - 25% }Gallium 5 - 10% }Iridium 0 - 0.01% } WITH THE PROVISO THAT THE TOTAL OF SAID PLATINUM AND PALLADIUM IS FROM ABOUT 5-10%.
申请公布号 US4014690(A) 申请公布日期 1977.03.29
申请号 US19760686347 申请日期 1976.05.14
申请人 HOWMEDICA, INC. 发明人 DUDEK, RONALD P.;KOSMOS, PETER;TESK, JOHN A.
分类号 B23K20/00;B23K35/30;C22C5/02;(IPC1-7):C22C5/02 主分类号 B23K20/00
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