发明名称 IMPLANTATION OF IONS INTO A METAL ELECTRODE
摘要 <p>Silicon ions are implanted in an aluminum or aluminum-copper film forming an electrode layer over a silicon dioxide layer on a semiconductor. The per cent by weight of silicon implanted into the metal film is greater than the per cent by weight of solid solubility of silicon in aluminum at the maximum processing temperature of the substrate that occurs after implantation. The peak of the implanted ion profile is preferably at the interface between the film and a silicon dioxide layer on the surface of the substrate.</p>
申请公布号 CA1007763(A) 申请公布日期 1977.03.29
申请号 CA19740202285 申请日期 1974.06.12
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 BOGARDUS, E. HAL;PERESSINI, PETER P.;REITH, TIMOTHY M.
分类号 H01L29/78;H01L21/00;H01L21/265;H01L21/28;H01L21/3215;H01L21/336;H01L29/00;H01L29/43 主分类号 H01L29/78
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