SOLDER BOND BETWEEN THE SEMICONDUCTOR CHIP AND SUBSTRATE
摘要
A solder bond between a semiconductor chip and a substrate is improved by the addition of a region of solder which is dispersion hardened with a ternary intermetallic. In the preferred embodiment the solder is constituted by a solid solution of tin in lead and a uniformly dispersed copper/tin/palladium ternary intermetallic. One of the constituents of the ternary intermetallic is a constituent of the solder.
申请公布号
CA1007760(A)
申请公布日期
1977.03.29
申请号
CA19740202289
申请日期
1974.06.12
申请人
INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人
HERDZIK, RICHARD J.;JEANNOTTE, DEXTER A.;PETERSON, GERALD W.;SULLIVAN, MICHAEL J.