摘要 |
A plating jig comprising a metal frame with an impervious covering of an electrically insulating material on the frame. At least one part of the frame is bare of the covering to permit contact being made with a component to be held by the jig for plating. A contact piece encloses said bare part and is formed of a non-conductive resiliently compressible matrix containing conductive particles such that a conductive path is established through the matrix wherever this is compressed. The contact piece is arranged to be compressed by contact with a component on the jig so as to establish an electrical connection between the frame and the component.
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