Pin for electric contact - provided with silver palladium contact layer enriched in palladium at surface

摘要

Pin having an Ag-Pd contact layer and opt. an intermediate layer is improved in that the Ag:Pd ratio varies across the contact layer, in particular the Pd content of the outer surface is about 50 wt. %. The Pd content is pref. >=30 wt. % throughout the whole contact layer. The Pd content at the boundary with the basic material of the pin is pref. equal to that at the outer surface (anyway is not 30 wt. %). The contact layer can be opt. provided with a 0.05-0.8 mu thick Au coating. These contacts are used in electronics and in telecommunication. They have high chemical resistance and low electric resistance, As the Ag-Pd and Au layers are very thin the cost is not high.