| 摘要 |
A mechanism is provided for soldering the leads of electronic components, such as integrated circuit elements, to corresponding conductors on a printed circuit board. The mechanism utilizes the known lap soldering reflow process by which the leads of the electronic component and the printed circuit conductors are solder coated, and a heated soldering tip holds each component lead and the corresponding printed circuit conductor in contact with one another while melting the solder on the lead and on the conductor. The soldering tip continues to hold the lead and conductor in contact with one another after the heat in the tip has been terminated and until the solder solidifies. The soldering tip is then removed leaving a soldered joint. The mechanism of the invention, in the embodiment to be described, includes two multi-tip soldering heads which can be adjusted to any desired longitudinal separation and to any desired lateral position with respect to the printed circuit board so as to align the soldering tips with the leads of a wide variety of electronic components on the board of varying sizes and shapes. The mechanism of the invention also has the ability to activate and set any combination of soldering tips to the soldering position so as to align selected soldering tips, for example, with integrated circuit component leads of different numbers of varying spacings. Also, the soldering tips of the mechanism of the invention each undergoes a stress reducing cycle during the soldering operation to reduce subsequent solder joint failure.
|
