发明名称 MOLDING DIE
摘要 PURPOSE:To enhance flatness by injection first resin out of a first injection gate into a first cavity, moving back a slide core in the state of pressing said resin with a press pin, injecting second resin out of a second injection gate into a second cavity and forming a main body section. CONSTITUTION:A moving mold 2 and a projected section 13 of a slide core 4 are faced to a fixed mold 1, and a press pin 12 is disposed at the bottom position of a first cavity 6. Transparent resin 9, for example, is injected from a first gate 8 into a first cavity 6 for molding, cooled and solidified. Then, the end surface of the projected section 13 of the slide core 4 is moved back to the same surface as the end surface forming a second cavity 3 of a movable mold 2, while the press pin 12 is held as it is, and black resin 5, for example, is injected from a second gate 7 for forming a main body section. The movable mold 2 is moved to the lower side after cooling and solidifying, and the molded product is released out of the mold by moving the press pin 12 upward. A two color molded product with good flatness and without warp is molded by said process.
申请公布号 JPH01259920(A) 申请公布日期 1989.10.17
申请号 JP19880089367 申请日期 1988.04.12
申请人 SONY CORP 发明人 YAHAGI MINORU
分类号 B29C45/16;B29C45/26;B29C45/36;B29L31/34;G11B23/087;G11B23/113 主分类号 B29C45/16
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