Method of forming a dual in-line package

摘要

A lead frame assembly of indefinite length having a pair of spaced parallel carrier strips, collapsible rungs extending between the strips at regular intervals along the length of the assembly and a number of leads extending inwardly from the opposed edges of the strip between the rungs are collapsed inwardly to seat the ends of the leads against the sides of circuit modules previously positioned between the ends of the leads. The lead ends are seated in recesses in the circuit modules and are subsequently soldered to metalized surfaces on the modules. Following the bending of the leads, the carrier strips and rungs are cut away.