| 摘要 |
<p>PURPOSE:To enhance strength without increasing in thickness and to improve reliability of an IC module by providing a reinforcing pattern over corresponding positions of a plurality of external connection terminals at a predetermined interval from a wiring pattern on the other face of a circuit board. CONSTITUTION:A reinforcing pattern 18 is formed at a predetermined interval around an IC chip 13 and a wiring pattern 15, and so formed as to fill a circuit board 11 of a position not provided with the chip 13 and the pattern 15. Accordingly, the pattern 18 is so formed as to cover the corresponding positions of a plurality of external connection terminals 12 at most part of the positions corresponding to a gap 14 of opposite side. Since the pattern 18 is formed on the rear face side of the gap 14 between the terminals 12 in this manner, even if the gap 14 is reinforced and a bending external force is applied to an IC module, the gap 14 is scarcely deformed to prevent the chip 13 from being damaging and fine metal wirings 16 from disconnecting.</p> |
