| 摘要 |
1467054 Semi-conductor devices SGS ATES COMPONENTI ELETTRONICI SpA 14 Feb 1974 [26 Sept 1973] 6694/74 Heading H1K A casing for a semi-conductor device of the kind described in Specification 1,273,589, including a resin body 30, Fig. 4B, moulded on a metal base-plate 11 having a thermal resistance of less than 3‹ C./watt to a semi-conductor chip (not shown) mounted thereon and dimensions equal to those of a JEDEC terminal case TO 220, is adapted to receive a five electrode chip. A contact strip 20, Fig. 3A, has groups comprising a central terminal 3 and four side terminals 1, 2, 4, 5 the central terminal 3 having an enlarged outer end for reception in a seat 14 in the baseplate 11 to which terminal 3 is electrically and physically connected. Wire connections between terminals 1, 2, 4, 5 and electrodes on the chip are effected by welding before encapsulation. Tie bars 12 and the redundant portion of contact strip 20 are removed, and the terminal portions outside the body 30 are bent alternately in opposite directions through 90 degrees, then through a further 90 degrees to space the now parallel terminal end portions from one another. |
