Heat sink with parallel flat faces

摘要

Disclosed is a unitary heat sink apparatus for dissipating thermal energy generated by semiconductor devices encapsulated in an encapsulation device of the JEDEC TO-202 or Motorola Case 152 device case style. The heat sink is a unitary sheet metal device folded to form two opposed end plates joined by a central barrel portion which acts as a spring to urge the opposed faces of the end plates together. The thermal conductor tab extending from the encapsulation device is held between the opposed faces of the end plates.