| 摘要 |
Methods of making an electrical probe diaphragm wherein the diaphragm is integral with the surrounding support structure, which methods are conducive to the fabrication probing circuitry integral therewith. In accordance with the method, a substrate having first and second surfaces is coated on the first surface with an uncured polymer film in the polymer cured. Also, one or more pattern metalization layers are provided, typical over the polymer layer and extending peripherally outward to contact regions near the periphery of the substrate, preferably accessible from the second side of the substrate so contact with the pattern metalization layer or layers forming the probe circuitry may be made from the second side of the substrate. The central region of the substrate thereafter removed, typically by etching from the second side of the substrate so as to remove the support for the polymer layer and metalization layers in that region, leaving the same as a diaphragm substantially integral with the remaining peripheral region of the substrate. Details of the methods and alternates thereto are disclosed.
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