Encapsulated microcircuit package and method for assembly thereof

摘要

A microcircuit deposited on a substrate is encapsulated within a housing having bottom and top cover portions. The substrate initially is adhesively secured to the bottom cover portion. The bottom and top cover portions then are placed into engagement, the assembled housing containing the substrate is cured, and a potting compound is injected into, and allowed to solidify between, the cover portions to encapsulate the microcircuit.