| 摘要 |
The module comprises a carrier on which a semiconductor chip is mounted, and a plurality of terminals to which various outputs of the chip are electrically connected, the terminals comprising metallized areas on one surface of the carrier. A liquid crystal cell is mounted within a frame including means for securing the frame to the carrier, resilient connector means being clamped between the liquid crystal cell and the carrier for electrically connecting different ones of the carrier terminals to different ones of electrodes of the cell.
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