| 发明名称 |
FLIP CHIP SOLDER BUMP |
| 摘要 |
PURPOSE:To secure a high-strength bump with easy manufacturing process by piling solder layers in such a way that the fusing point of each layer lowers consecutively. |
| 申请公布号 |
JPS5232670(A) |
申请公布日期 |
1977.03.12 |
| 申请号 |
JP19750108788 |
申请日期 |
1975.09.08 |
| 申请人 |
MITSUBISHI ELECTRIC CORP |
发明人 |
KATAOKA MASAYUKI;KAWAKAMI TAKAYOSHI;YOKOTA SHIROU |
| 分类号 |
H05K3/34;B23K35/00;B23K35/14;H01L21/60 |
主分类号 |
H05K3/34 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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