High power density solid-state, insulating coolant module

摘要

A high power density semiconductor module of reduced size and weight wherein a fusion element assembly for meeting electrical power processing requirements is nested in a hollow casing for both electrically insulating and operatively cooling by a single fluid medium. A pair of electrically conductive terminals penetrates the casing at opposite ends to make an electrical path through the fusion element assembly which resides within the casing as a stack in which each semiconductor fusion element is interleaved with plural heat sink elements undergoing a uniform compressive loading parameter. The stack is electrically insulated and cooled through transverse grooves in the fusion element assembly, which in one embodiment for space based utilization, is by way of finned heat sink or backing plate elements for passaging a dual function cryogen fluid such as supercritical liquid hydrogen. A terrestrial aviation or marine based utilization, provides that an ester base cooling oil having good dielectric properties may be instead used.