| 发明名称 |
CERAMIC PACKAGE |
| 摘要 |
<p>A ceramic package includes a high thermal conductive ceramic substrate (AlN or SiC sintered substrate) on which a semiconductor element is mounted, and a mullite sintered frame having metal conductive paths therein and joined to the substrate.</p> |
| 申请公布号 |
KR910002811(B1) |
申请公布日期 |
1991.05.04 |
| 申请号 |
KR19880005343 |
申请日期 |
1988.05.09 |
| 申请人 |
SHIKO ELECTRIC IND.CO.,LTD. |
发明人 |
HORIKUTCHI MITCHIO;MICHUSHIMA KIHO |
| 分类号 |
H01L23/08;H01L23/02;H01L23/15;(IPC1-7):H01L23/053 |
主分类号 |
H01L23/08 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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