| 发明名称 |
Copper foil having bond strength |
| 摘要 |
A copper foil having high bond strength with an insoluble particle-containing metal plate formed thereon, the plated copper foil being adapted for use in the preparation of, for example, a printed circuit.
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| 申请公布号 |
US4010005(A) |
申请公布日期 |
1977.03.01 |
| 申请号 |
US19740477587 |
申请日期 |
1974.06.10 |
| 申请人 |
MITSUI-ANACONDA ELECTRO COPPER SHEET CO., LTD. |
发明人 |
MORISAKI, SHIGEYOSHI;MASE, KAZUO |
| 分类号 |
B32B15/04;B32B15/08;C23C30/00;C25D7/06;C25D15/02;H05K3/38;(IPC1-7):B32B15/20 |
主分类号 |
B32B15/04 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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