| 摘要 |
A warp-resistant heat sink suitable for soldering to one side of a relatively fragile, ceramic semiconductor substrate comprises a plate of heat-conducting material having a plurality of slits along two sides thereof, and a plurality of U-shaped heat-conducting members each of which extends through a respective one of the slits in the plate. The U-shaped heat-conducting members are soldered to the same side of the plate, the members along one edge of the plate being off-set with respect to the members along the opposite side of the plate in order to increase the heat transfer efficiency when air is forced through the heat sink. The plate material is selected so as to have a substantially identical thermal coefficient of expansion as that of the substrate material. When the heat sink plate is soldered to the substrate surface, a laminate is thereby formed comprising two outer layers of material having substantially identical thermal coefficients of expansion and an inner layer having a different thermal coefficient of expansion. Relatively large heat sinks can thus be fabricated which have a high resistance to the warpage which would otherwise result from the dissimilar thermal expansion and contraction of the ceramic substrate and the heat-conducting members.
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