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发明名称
MANUFACTURING METHOD OF DISC WAFER CASING JIG
摘要
申请公布号
JPS5226173(A)
申请公布日期
1977.02.26
申请号
JP19750101241
申请日期
1975.08.22
申请人
HITACHI LTD
发明人
ISHII SEIICHI
分类号
H01L21/673;H01L21/22;H01L21/68
主分类号
H01L21/673
代理机构
代理人
主权项
地址
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