| 摘要 |
PROBLEM TO BE SOLVED: To restrain a stress applied to a bellows which partitions the movement means of a wafer holding implement and a film formation chamber and to miniaturize an apparatus by a method wherein the apparatus is provided with a movement shaft which moves an object, to be treated, back and forth in the axial direction between a treatment chamber whose pressure can be adjusted and a reserve chamber which is connected to the chamber via an opening and the inside and the outside of a movement-shaft installation part is partitioned by an expansion and contraction means. SOLUTION: A manufacturing apparatus is provided with a movement shaft 72 by which an object to be treated is moved back and forth in the axial direction between a treatment chamber 20 and a reserve chamber 26, with a holding implement 30 and a holding implement 39 which are fixed to the movement shaft 72 used to close an opening 56 when the object to be treated is held so as to be inserted into the treatment chamber 20, with an expansion and contraction means 33 which is attached around the movement shaft 72 so as to be expanded and contracted in the axial direction and which forms an installation part 35 whose pressure can be adjusted at its inside and with a housing chamber 34 in which the movement shaft 72 and the expansion and contraction means 33 are housed, which is connected to the reserve chamber 26 in a part used to bond the movement shaft 72 and the holding implements 30, 39 and whose pressure can be adjusted. Thereby, the introduction of dust particles from a moving part to the treatment chamber 20 or the reserve chamber 26 is prevented, a stress which is applied to the expansion and contraction means 33 is suppressed, and the space of the apparatus can be saved. |
