发明名称 |
ELECTRONIC PARTS |
摘要 |
An electronic module having two insulating substrates which are provided with printed wiring and which are connected to circuit elements, and mounted against opposite sides of a heat-dissipating body. The sides of the substrates are remote from the sides supporting the printed wiring and/or thin-layer circuit elements are glued to the heat-dissipating body which is between the substrates, and the required connection leads are enveloped by an insulating envelope. |
申请公布号 |
JPS5225257(A) |
申请公布日期 |
1977.02.25 |
申请号 |
JP19760097833 |
申请日期 |
1976.08.18 |
申请人 |
PHILIPS* GLOEILAMPENFABRIEKEN NV |
发明人 |
EDOWAADO UDEN;BIRUHERUMU SHIYURAIHAAGE;YOHAN KURISUTEIAN YAKOBUSU FUINKU |
分类号 |
H01L23/34;H01L23/433;H05K1/14;H05K5/00;H05K7/20 |
主分类号 |
H01L23/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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