发明名称 PLATTIERTER NACHGIEBIGER LEITER
摘要 <p>A curved lead provides a mechanical and electrical connection between a board contact on a circuit board and a chip contact associated with a circuit chip. The chip can be mounted to the circuit board, to a chip carrier or to a multiple-chip module. The curved lead is substantially entirely plated with solder and is formed of a single piece of conductive material. The curved lead has a first surf ace for connection to the chip contact and a second surface, generally parallel to the first surface, for connection to the board contact. The first and second surfaces are connected by at least one curved portion and are arranged to mount the circuit chip to the circuit board with the solder in a compliant, generally parallel arrangement substantially free of stress.</p>
申请公布号 DE69222957(D1) 申请公布日期 1997.12.04
申请号 DE1992622957 申请日期 1992.09.30
申请人 CERIDIAN CORP., BLOOMINGTON, MINN., US 发明人 PAI, DEEPAK, KESHAV, BURNSVILLE, MN 55337, US;KRINKE, TERRENCE, ALBERT, ROSEVILLE, MN 55113, US
分类号 H01L23/043;H01L23/498;H01R12/57;H05K1/02;H05K3/34;H05K3/36;H05K13/00;H05K13/04;(IPC1-7):H05K3/34;H01R9/09 主分类号 H01L23/043
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