| 摘要 |
1465629 Semi-conductor devices WESTING- HOUSE ELECTRIC CORP 1 May 1974 [16 May 1973] 19117/74 Heading H1K A field effect transistor comprises a substrate 33 of first conductivity type, Fig. 2D, on which is a first layer 35 of second conductivity type and a second layer 37 of first conductivity type, at least two spaced regions of insulating material 39 on the second layer, there being a groove 91, Fig. 2H, between the two insulating regions which penetrates through the first and second layers 35, 37 down to the substrate 33 and the groove 91 being overhung by the parts 95, 97 of the two insulating regions, the surface of the groove 91 being coated with an electrically insulating material 93 on which an electrode 111 is formed on that part of the groove under the overhang of one of the parts 95, 97, the electrode being only opposite the edge of the first layer 35 extending along the groove. In the fabrication of such a transistor, on the epitaxial N+PN+ silicon body 31 a number of SiO 2 fingers 61, Fig. 1, extending from a projection 63 are formed, each finger in addition including a slot 67 therein which exposes the second layer 37 and the spaces between the fingers 61 being where subsequently the grooves 91 are formed in the body. Over the fingers 61 a first layer of Si 3 N 4 is formed which in turn is selectively covered by regions 77 of SiO 2 over the slots 67 and immediately adjacent regions, Fig. 2D. The Si 3 N 4 and the underlying body regions are then etched away to expose the substrate 33 at the bottom of the grooves 91, an SiO 2 layer 93 then being formed over the surface of the grooves. The remaining SiO 2 and Si 3 N 4 regions are removed from the surface of the body 31 to expose the surfaces for the drain electrodes The gate electrodes 111 and the drain electrodes 113 are deposited simultaneously by projecting a linear metal vapour stream (indicated by arrows in Fig. 2H) at an appropriate angle to the surface whereby the overhangs 95, 97 serve as a mask for the gate electrode 111 deposited in the grooves. The direction of the metalvapour stream is then altered to the supplement of the first angle to form a similar gate electrode under the opposite overhang and to enhance the conductivity of the drain electrodes. The spaced gate and drain electrode regions are connected to respective common pads 63, 65, Fig. 1. Several thousand of such FET's can be produced on a layered slice of doped semi-conductor of one square inch area. Detailed manufacturing processing steps, typical dimensions and the characteristics of the devices so produced are disclosed. Apparatus for effecting the particular angular gate evaporation is described, Figs. 5 and 6 (not shown). The MOSFET thus produced is able to deliver microwave power at high frequency with high input impedance.
|
