发明名称 Gold deposition procedures and substrates upon which gold has been deposited
摘要 A method for electroless gold plating in which gold ligand complexes are used; a photolytic method for depositing catalytic amounts of gold on a substrate suitable for an electroless metal deposition method whereby the gold complexes used are trivalent gold complex; a method for immersion plating or vaporization plating of gold from complexes, and complexes for the above methods.
申请公布号 US4009297(A) 申请公布日期 1977.02.22
申请号 US19740553047 申请日期 1974.02.25
申请人 AMP INCORPORATED 发明人 REDMOND, JOHN PETER;ANDREWS, DANIEL MARSHALL;GUYLER, KARL EDWARD
分类号 C23C18/44;(IPC1-7):B05D3/06;C23C11/02 主分类号 C23C18/44
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