发明名称 |
Gold deposition procedures and substrates upon which gold has been deposited |
摘要 |
A method for electroless gold plating in which gold ligand complexes are used; a photolytic method for depositing catalytic amounts of gold on a substrate suitable for an electroless metal deposition method whereby the gold complexes used are trivalent gold complex; a method for immersion plating or vaporization plating of gold from complexes, and complexes for the above methods.
|
申请公布号 |
US4009297(A) |
申请公布日期 |
1977.02.22 |
申请号 |
US19740553047 |
申请日期 |
1974.02.25 |
申请人 |
AMP INCORPORATED |
发明人 |
REDMOND, JOHN PETER;ANDREWS, DANIEL MARSHALL;GUYLER, KARL EDWARD |
分类号 |
C23C18/44;(IPC1-7):B05D3/06;C23C11/02 |
主分类号 |
C23C18/44 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|